Publication:
Three-tiered risk assessment for engineered nanomaterials. A use case for the semiconductor industry
Date
| dc.contributor.author | Prodanov, Dimiter | |
| dc.contributor.author | Belde, P. | |
| dc.contributor.author | Geerts, L. | |
| dc.contributor.author | L'Allain, C. | |
| dc.contributor.author | Le Feber, M. | |
| dc.contributor.author | Moclair, F. | |
| dc.contributor.author | Morelli, A. | |
| dc.contributor.author | Roquet, P. | |
| dc.contributor.imecauthor | Prodanov, Dimiter | |
| dc.contributor.orcidimec | Prodanov, Dimiter::0000-0001-8694-0535 | |
| dc.date.accessioned | 2021-10-27T16:24:36Z | |
| dc.date.available | 2021-10-27T16:24:36Z | |
| dc.date.issued | 2019 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/33829 | |
| dc.identifier.url | https://iopscience.iop.org/article/10.1088/1742-6596/1323/1/012010/pdf | |
| dc.source.beginpage | 12010 | |
| dc.source.conference | 6th NanoSAFE International Conference 2018 | |
| dc.source.conferencedate | 5/11/2018 | |
| dc.source.conferencelocation | Grenoble France | |
| dc.title | Three-tiered risk assessment for engineered nanomaterials. A use case for the semiconductor industry | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |