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Conference contributions
NiB Capping of Cu landing pads for thermocompression bonding
Publication:
NiB Capping of Cu landing pads for thermocompression bonding
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Date
2014
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
England, Luke
;
Dictus, Dries
;
De Vos, Joeri
;
Conard, Thierry
;
Daily, Robert
;
Marinissen, Erik Jan
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1911
since deposited on 2021-10-22
2
last month
Acq. date: 2025-12-11
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1911
since deposited on 2021-10-22
2
last month
Acq. date: 2025-12-11
Citations