Publication:
Impact of wafer thinning on ESD protection devices in 3D integrated systems
Date
| dc.contributor.author | Scholz, Mirko | |
| dc.contributor.author | Vaisman Chasin, Adrian | |
| dc.contributor.author | Linten, Dimitri | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Vaisman Chasin, Adrian | |
| dc.contributor.imecauthor | Linten, Dimitri | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Vaisman Chasin, Adrian::0000-0002-9940-0260 | |
| dc.contributor.orcidimec | Linten, Dimitri::0000-0001-8434-1838 | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-23T14:42:21Z | |
| dc.date.available | 2021-10-23T14:42:21Z | |
| dc.date.issued | 2016-05 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/27282 | |
| dc.source.beginpage | C5 | |
| dc.source.conference | International ESD Workshop - IEW | |
| dc.source.conferencedate | 16/05/2016 | |
| dc.source.conferencelocation | Tutzing Germany | |
| dc.title | Impact of wafer thinning on ESD protection devices in 3D integrated systems | |
| dc.type | Meeting abstract | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |