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How to Keep Pushing ML Accelerator Performance? Know Your Rooflines!

 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0003-3495-9263
cris.virtualsource.departmentc84426b5-5f84-48ba-9153-1fe96862af32
cris.virtualsource.orcidc84426b5-5f84-48ba-9153-1fe96862af32
dc.contributor.authorVerhelst, Marian
dc.contributor.authorBenini, Luca
dc.contributor.authorVerma, Naveen
dc.contributor.imecauthorVerhelst, Marian
dc.contributor.orcidimecVerhelst, Marian::0000-0003-3495-9263
dc.date.accessioned2025-05-10T05:36:12Z
dc.date.available2025-05-10T05:36:12Z
dc.date.issued2025
dc.description.abstractThe rapidly growing importance of machine learning (ML) applications, coupled with their ever-increasing model size and inference energy footprint, has created a strong need for specialized ML hardware architectures. Numerous ML accelerators have been explored and implemented, primarily to increase task-level throughput per unit area and reduce task-level energy consumption. This article surveys key trends toward these objectives for more efficient ML accelerators and provides a unifying framework to understand how compute and memory technologies/architectures interact to enhance system-level efficiency and performance. To achieve this, this article introduces an enhanced version of the roofline model and applies it to ML accelerators as an effective tool for understanding where various execution regimes fall within roofline bounds and how to maximize performance and efficiency under the roofline. Key concepts are illustrated with examples from state-of-the-art (SOTA) designs, with a view toward open research opportunities to further advance accelerator performance.
dc.description.wosFundingTextThis work was supported in part by European Research Council (ERC); in part by the Flanders Artificial Intelligence (AI) Research (FAIR) Program; and in part by the Swiss State Secretariat for Education, Research, and Innovation (SERI) through the SwissChips Initiative and Defense Advanced Research Projects Agency (DARPA) Optimal Processing Technology Inside Memory Arrays (OPTIMA) under Grant HR00112490300.
dc.identifier.doi10.1109/JSSC.2025.3553765
dc.identifier.issn0018-9200
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45618
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage1888
dc.source.endpage1905
dc.source.issue6
dc.source.journalIEEE JOURNAL OF SOLID-STATE CIRCUITS
dc.source.numberofpages18
dc.source.volume60
dc.title

How to Keep Pushing ML Accelerator Performance? Know Your Rooflines!

dc.typeJournal article
dspace.entity.typePublication
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