Publication:

Screening and evaluation of different wet cleaning solution for post etch residue removal in BEOL applications

Date

2009
Proceedings Paper
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dc.contributor.authorSuhard, Samuel
dc.contributor.authorClaes, Martine
dc.contributor.authorLoh, James
dc.contributor.authorVereecke, Guy
dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorDemuynck, Steven
dc.contributor.authorVereecke, Bart
dc.contributor.authorBeyer, Gerald
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorVereecke, Bart
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.accessioned2021-10-18T03:27:29Z
dc.date.available2021-10-18T03:27:29Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16282
dc.source.beginpage101
dc.source.conferenceCleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 11
dc.source.conferencedate4/10/2009
dc.source.conferencelocationVienna Austria
dc.source.endpage107
dc.title

Screening and evaluation of different wet cleaning solution for post etch residue removal in BEOL applications

dc.typeProceedings paper
dspace.entity.typePublication
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