Publication:

Low temperature flip chip with adhesives on PES

Date

2003
Proceedings Paper
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-6843-7124
cris.virtual.orcid0000-0002-9654-7304
cris.virtualsource.department1dc11e64-aa39-490e-bcc3-69d863ad56bb
cris.virtualsource.department44a3a82b-55ff-4186-b5db-5e0130b85450
cris.virtualsource.orcid1dc11e64-aa39-490e-bcc3-69d863ad56bb
cris.virtualsource.orcid44a3a82b-55ff-4186-b5db-5e0130b85450
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorPodprocky, Tomas
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorMäättänen, Jarmo
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned2021-10-15T07:23:11Z
dc.date.available2021-10-15T07:23:11Z
dc.date.embargo9999-12-31
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8309
dc.source.beginpage319
dc.source.conference14th European Microelectronics and Packaging Conference & Exhibition
dc.source.conferencedate23/06/2003
dc.source.conferencelocationFriedrichshafen Germany
dc.source.endpage324
dc.title

Low temperature flip chip with adhesives on PES

dc.typeProceedings paper
dspace.entity.typePublication
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