Publication:
Experimental validation of a star-shaped thermal compact model for underfilled flip chip assemblies
Date
| dc.contributor.author | Driessens, Evelien | |
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Corlatan, D. | |
| dc.contributor.author | Roose, E. | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-14T21:32:58Z | |
| dc.date.available | 2021-10-14T21:32:58Z | |
| dc.date.issued | 2002 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/6289 | |
| dc.source.beginpage | 46 | |
| dc.source.conference | Proceedings of the 8th International Workshop on Thermal Investigations of ICs and Systems - Therminic | |
| dc.source.conferencedate | 1/10/2002 | |
| dc.source.conferencelocation | Madrid Spain | |
| dc.source.endpage | 49 | |
| dc.title | Experimental validation of a star-shaped thermal compact model for underfilled flip chip assemblies | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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