Publication:
A parylene temporary packaging technique for MEMS wafer handling
Date
| dc.contributor.author | Wen, Lianggong | |
| dc.contributor.author | Wouters, K. | |
| dc.contributor.author | Ceyssens, F. | |
| dc.contributor.author | Witvrouw, Ann | |
| dc.contributor.author | Puers, Bob | |
| dc.contributor.imecauthor | Puers, Bob | |
| dc.date.accessioned | 2021-10-20T18:56:54Z | |
| dc.date.available | 2021-10-20T18:56:54Z | |
| dc.date.issued | 2012 | |
| dc.identifier.issn | 0924-4247 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/21846 | |
| dc.identifier.url | http://dx.doi.org/10.1016/j.sna2012.03.047 | |
| dc.source.beginpage | 289 | |
| dc.source.endpage | 297 | |
| dc.source.journal | Sensors and Actuators A: Physical | |
| dc.source.volume | 186 | |
| dc.title | A parylene temporary packaging technique for MEMS wafer handling | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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