Publication:

2D materials: roadmap to CMOS integration

Date

2018
Proceedings Paper
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dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorSchram, Tom
dc.contributor.authorSmets, Quentin
dc.contributor.authorAgarwal Kumar, Tarun
dc.contributor.authorVerreck, Devin
dc.contributor.authorBrems, Steven
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorChiappe, Daniele
dc.contributor.authorEl Kazzi, Salim
dc.contributor.authorLockhart de la Rosa, Cesar Javier
dc.contributor.authorArutchelvan, Goutham
dc.contributor.authorCott, Daire
dc.contributor.authorLudwig, Jonathan
dc.contributor.authorGaur, Abhinav
dc.contributor.authorSutar, Surajit
dc.contributor.authorLeonhardt, Alessandra
dc.contributor.authorMarinov, Daniil
dc.contributor.authorLin, Dennis
dc.contributor.authorCaymax, Matty
dc.contributor.authorAsselberghs, Inge
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorSchram, Tom
dc.contributor.imecauthorSmets, Quentin
dc.contributor.imecauthorVerreck, Devin
dc.contributor.imecauthorBrems, Steven
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorLockhart de la Rosa, Cesar Javier
dc.contributor.imecauthorArutchelvan, Goutham
dc.contributor.imecauthorCott, Daire
dc.contributor.imecauthorLudwig, Jonathan
dc.contributor.imecauthorGaur, Abhinav
dc.contributor.imecauthorSutar, Surajit
dc.contributor.imecauthorLeonhardt, Alessandra
dc.contributor.imecauthorLin, Dennis
dc.contributor.imecauthorCaymax, Matty
dc.contributor.imecauthorAsselberghs, Inge
dc.contributor.imecauthorPourtois, Geoffrey
dc.contributor.imecauthorRadu, Iuliana
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.contributor.orcidimecSchram, Tom::0000-0003-1533-7055
dc.contributor.orcidimecSmets, Quentin::0000-0002-2356-5915
dc.contributor.orcidimecVerreck, Devin::0000-0002-3833-5880
dc.contributor.orcidimecBrems, Steven::0000-0002-0282-8528
dc.contributor.orcidimecPourtois, Geoffrey::0000-0003-2597-8534
dc.contributor.orcidimecRadu, Iuliana::0000-0002-7230-7218
dc.date.accessioned2021-10-25T20:05:25Z
dc.date.available2021-10-25T20:05:25Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30927
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8614679
dc.source.beginpage512
dc.source.conferenceIEEE Electron Devices Meeting - IEDM
dc.source.conferencedate1/12/2018
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage515
dc.title

2D materials: roadmap to CMOS integration

dc.typeProceedings paper
dspace.entity.typePublication
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