Publication:

Thermal-stability optimization of Al2O3/Cu-Te based conductive-bridging random access memory systems

Date

2013
Journal article
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dc.contributor.authorGoux, Ludovic
dc.contributor.authorOpsomer, Karl
dc.contributor.authorFranquet, Alexis
dc.contributor.authorKar, Gouri Sankar
dc.contributor.authorJossart, Nico
dc.contributor.authorRichard, Olivier
dc.contributor.authorWouters, Dirk
dc.contributor.authorMuller, Robert
dc.contributor.authorDetavernier, C.
dc.contributor.authorJurczak, Gosia
dc.contributor.authorKittl, Jorge
dc.contributor.imecauthorGoux, Ludovic
dc.contributor.imecauthorOpsomer, Karl
dc.contributor.imecauthorFranquet, Alexis
dc.contributor.imecauthorKar, Gouri Sankar
dc.contributor.imecauthorJossart, Nico
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorJurczak, Gosia
dc.contributor.orcidimecGoux, Ludovic::0000-0002-1276-2278
dc.contributor.orcidimecFranquet, Alexis::0000-0002-7371-8852
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.date.accessioned2021-10-21T07:57:03Z
dc.date.available2021-10-21T07:57:03Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.issn0040-6090
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22419
dc.source.beginpage29
dc.source.endpage33
dc.source.journalThin Solid Films
dc.source.volume533
dc.title

Thermal-stability optimization of Al2O3/Cu-Te based conductive-bridging random access memory systems

dc.typeJournal article
dspace.entity.typePublication
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