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Optimal Sensor Placement for Thermal Virtual Sensing in electronic systems using Augmented Kalman Filtering

 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-6753-6438
cris.virtualsource.department7f3b6157-524f-4c79-8ef4-0ce61cf88c54
cris.virtualsource.department0aefe159-9129-4bab-908e-3a73693ee2e4
cris.virtualsource.orcid7f3b6157-524f-4c79-8ef4-0ce61cf88c54
cris.virtualsource.orcid0aefe159-9129-4bab-908e-3a73693ee2e4
dc.contributor.authorDepaola, Matteo
dc.contributor.authorDe Gregoriis, Daniel
dc.contributor.authorBornoff, Robin
dc.contributor.authorVandevelde, Bart
dc.contributor.authorMoens, David
dc.date.accessioned2026-09-21T09:40:46Z
dc.date.available2026-09-21T09:40:46Z
dc.date.createdwos2026
dc.date.issued2025
dc.description.abstractThe estimation of thermal parameters varying during the lifecycle of Electronic Components and Systems (ECS) is enabled by Digital Twins (DTs). The estimation performance depends on the number and utility of the chosen sensing locations. Moreover, large thermal gradients in ECS may cause misleading measurements resulting in wrong estimates. The presented Optimal Sensor Placement (OSP) algorithm considers parameter uncertainties thanks to the utilized DT framework composed of an Augmented Kalman Filter employing a parameter dependent thermal Reduced Order Model. Robustness in the sensor selection process is enforced by providing the OSP algorithm with the thermal gradients in the candidate sensing locations. A simulation study highlights the validity of the proposed methodology and opens to experimental validation.
dc.description.wosFundingTextThe authors would like to thank the support from the European Commission through the Marie Curie project MIRELAI, funded by the European Union (Grant Agreement No. 101072491). Views and opinions expressed are however those of the authors only and do not necessarily reflect those of the European Union or the European Research Executive Agency. Neither the European Union nor the granting authority can be held responsible for them. Partners from the UK are supported by the UK Engineering and Physical Sciences Research Council.
dc.identifier.doi10.1109/therminic65879.2025.11216915
dc.identifier.isbn979-8-3315-9487-9
dc.identifier.issn2474-1515
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/60423
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE
dc.relation.ispartofseriesInternational Workshop on Thermal Investigation of ICs and Systems
dc.source.beginpage1
dc.source.conference31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
dc.source.conferencedate2025-09-24
dc.source.conferencelocationNaples
dc.source.endpage6
dc.source.journal2025 31ST INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS, THERMINIC
dc.source.numberofpages6
dc.title

Optimal Sensor Placement for Thermal Virtual Sensing in electronic systems using Augmented Kalman Filtering

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2025-10-22
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-09-20
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