Publication:
Optimal Sensor Placement for Thermal Virtual Sensing in electronic systems using Augmented Kalman Filtering
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0002-6753-6438 | |
| cris.virtualsource.department | 7f3b6157-524f-4c79-8ef4-0ce61cf88c54 | |
| cris.virtualsource.department | 0aefe159-9129-4bab-908e-3a73693ee2e4 | |
| cris.virtualsource.orcid | 7f3b6157-524f-4c79-8ef4-0ce61cf88c54 | |
| cris.virtualsource.orcid | 0aefe159-9129-4bab-908e-3a73693ee2e4 | |
| dc.contributor.author | Depaola, Matteo | |
| dc.contributor.author | De Gregoriis, Daniel | |
| dc.contributor.author | Bornoff, Robin | |
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Moens, David | |
| dc.date.accessioned | 2026-09-21T09:40:46Z | |
| dc.date.available | 2026-09-21T09:40:46Z | |
| dc.date.createdwos | 2026 | |
| dc.date.issued | 2025 | |
| dc.description.abstract | The estimation of thermal parameters varying during the lifecycle of Electronic Components and Systems (ECS) is enabled by Digital Twins (DTs). The estimation performance depends on the number and utility of the chosen sensing locations. Moreover, large thermal gradients in ECS may cause misleading measurements resulting in wrong estimates. The presented Optimal Sensor Placement (OSP) algorithm considers parameter uncertainties thanks to the utilized DT framework composed of an Augmented Kalman Filter employing a parameter dependent thermal Reduced Order Model. Robustness in the sensor selection process is enforced by providing the OSP algorithm with the thermal gradients in the candidate sensing locations. A simulation study highlights the validity of the proposed methodology and opens to experimental validation. | |
| dc.description.wosFundingText | The authors would like to thank the support from the European Commission through the Marie Curie project MIRELAI, funded by the European Union (Grant Agreement No. 101072491). Views and opinions expressed are however those of the authors only and do not necessarily reflect those of the European Union or the European Research Executive Agency. Neither the European Union nor the granting authority can be held responsible for them. Partners from the UK are supported by the UK Engineering and Physical Sciences Research Council. | |
| dc.identifier.doi | 10.1109/therminic65879.2025.11216915 | |
| dc.identifier.isbn | 979-8-3315-9487-9 | |
| dc.identifier.issn | 2474-1515 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/60423 | |
| dc.language.iso | eng | |
| dc.provenance.editstepuser | greet.vanhoof@imec.be | |
| dc.publisher | IEEE | |
| dc.relation.ispartofseries | International Workshop on Thermal Investigation of ICs and Systems | |
| dc.source.beginpage | 1 | |
| dc.source.conference | 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) | |
| dc.source.conferencedate | 2025-09-24 | |
| dc.source.conferencelocation | Naples | |
| dc.source.endpage | 6 | |
| dc.source.journal | 2025 31ST INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS, THERMINIC | |
| dc.source.numberofpages | 6 | |
| dc.title | Optimal Sensor Placement for Thermal Virtual Sensing in electronic systems using Augmented Kalman Filtering | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| imec.internal.crawledAt | 2025-10-22 | |
| imec.internal.source | crawler | |
| imec.internal.wosCreatedAt | 2026-09-20 | |
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