Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
imec Publications
Articles
Copper through silicon vias studied by the photo-elastic Scanning Infrared Microscope SIREX
Publication:
Copper through silicon vias studied by the photo-elastic Scanning Infrared Microscope SIREX
Date
2016
Journal article
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Herms, Martin
;
Wagner, M.
;
De Wolf, Ingrid
Journal
Microelectronics Reliability
Abstract
Description
Metrics
Views
1885
since deposited on 2021-10-23
403
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations
Metrics
Views
1885
since deposited on 2021-10-23
403
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations