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NH2-terminated self-assembled monolayer as copper diffusion barrier: monolayer characterization

Date

2009
Meeting abstract
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dc.contributor.authorMaestre Caro, Arantxa
dc.contributor.authorTravaly, Youssef
dc.contributor.authorArmini, Silvia
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.date.accessioned2021-10-18T00:23:01Z
dc.date.available2021-10-18T00:23:01Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15783
dc.source.conference18th Workshop Materials for Advanced Metallization - MAM
dc.source.conferencedate8/03/2009
dc.source.conferencelocationGrenoble France
dc.title

NH2-terminated self-assembled monolayer as copper diffusion barrier: monolayer characterization

dc.typeMeeting abstract
dspace.entity.typePublication
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