Publication:

Chip-package co-design of a 4.7 GHz VCO

Date

1999
Proceedings Paper
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dc.contributor.authorDonnay, Stephane
dc.contributor.authorVaesen, Kristof
dc.contributor.authorPieters, Philip
dc.contributor.authorDiels, Wim
dc.contributor.authorWambacq, P.
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.contributor.authorEngels, Marc
dc.contributor.authorBolsens, Ivo
dc.contributor.imecauthorDonnay, Stephane
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorPieters, Philip
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-06T11:06:28Z
dc.date.available2021-10-06T11:06:28Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3431
dc.source.beginpage145
dc.source.conferenceICM'99. The eleventh international conference on microelectronics. Proceedings;
dc.source.endpage148
dc.title

Chip-package co-design of a 4.7 GHz VCO

dc.typeProceedings paper
dspace.entity.typePublication
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