Publication:

Reliability analysis of Cu contacts with various diffusion barriers

Date

2009
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorKauerauf, Thomas
dc.contributor.authorDemuynck, Steven
dc.contributor.authorTokei, Zsolt
dc.contributor.authorCroes, Kristof
dc.contributor.authorBeyer, Gerald
dc.contributor.authorGroeseneken, Guido
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-17T23:21:02Z
dc.date.available2021-10-17T23:21:02Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15575
dc.source.beginpage727
dc.source.conferenceAdvanced Metallization Conference 2008 (AMC 2008)
dc.source.conferencedate23/09/2008
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage731
dc.title

Reliability analysis of Cu contacts with various diffusion barriers

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
18763.pdf
Size:
825.8 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions