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High-density and alignment-tolerant integration of monitoring photodetector arrays onto polymeric guided-wave components

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dc.contributor.authorVan der Linden, J. E.
dc.contributor.authorDe Dobbelaere, Peter
dc.contributor.authorVan Daele, Peter
dc.contributor.authorDiemeer, M. B.
dc.contributor.imecauthorVan Daele, Peter
dc.contributor.orcidimecVan Daele, Peter::0000-0003-0557-7741
dc.date.accessioned2021-10-14T11:46:27Z
dc.date.available2021-10-14T11:46:27Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3917
dc.source.beginpage534
dc.source.endpage540
dc.source.issue4
dc.source.journalIEEE Trans. Components, Packaging and Manufacturing Technology B: Advanced Packaging
dc.source.volume22
dc.title

High-density and alignment-tolerant integration of monitoring photodetector arrays onto polymeric guided-wave components

dc.typeJournal article
dspace.entity.typePublication
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