Publication:

Flip chip assembly using SBB of high frequency GaAs modules

Date

2002
Proceedings Paper
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dc.contributor.authorStoukatch, Serguei
dc.contributor.authorHo, Meng
dc.contributor.authorVaesen, Kristof
dc.contributor.authorBrebels, Steven
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorBrebels, Steven
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-14T23:16:00Z
dc.date.available2021-10-14T23:16:00Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6853
dc.source.conferenceMicroTech
dc.source.conferencedate29/01/2002
dc.source.conferencelocationManchester UK
dc.title

Flip chip assembly using SBB of high frequency GaAs modules

dc.typeProceedings paper
dspace.entity.typePublication
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