Publication:
Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly
Date
| dc.contributor.author | Lofrano, Melina | |
| dc.contributor.author | Cherman, Vladimir | |
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Lofrano, Melina | |
| dc.contributor.imecauthor | Cherman, Vladimir | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-25T22:23:54Z | |
| dc.date.available | 2021-10-25T22:23:54Z | |
| dc.date.issued | 2018 | |
| dc.identifier.issn | 0026-2714 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/31222 | |
| dc.identifier.url | https://www.sciencedirect.com/science/article/pii/S0026271418303792 | |
| dc.source.beginpage | 97 | |
| dc.source.endpage | 105 | |
| dc.source.journal | Microelectronics Reliability | |
| dc.source.volume | 87 | |
| dc.title | Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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