Publication:
Analysis of TSV-induced strain in silicon by Raman spectroscopy
Date
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.date.accessioned | 2021-10-18T15:55:08Z | |
| dc.date.available | 2021-10-18T15:55:08Z | |
| dc.date.issued | 2010 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/16984 | |
| dc.source.conference | Fraunhofer Workshop on Stress Management for 3D IC's Using Through Silicon Vias | |
| dc.source.conferencedate | 20/10/2010 | |
| dc.source.conferencelocation | Dresden Germany | |
| dc.title | Analysis of TSV-induced strain in silicon by Raman spectroscopy | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
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