Publication:
Bonding induced distortion in wafer-to-wafer bonding applications: how the scanner and Yieldstar can enable 3D integration
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| cris.virtual.orcid | 0000-0002-7610-0513 | |
| cris.virtual.orcid | 0000-0003-4308-0381 | |
| cris.virtual.orcid | 0009-0009-7686-4474 | |
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| cris.virtualsource.orcid | 631cd095-bf2a-4dde-b9c6-cd240a405a24 | |
| dc.contributor.author | Blanco, Victor | |
| dc.contributor.author | Renaud, Vincent | |
| dc.contributor.author | Iacovo, Serena | |
| dc.contributor.author | Jourdain, Anne | |
| dc.contributor.author | Hsu, A. | |
| dc.contributor.author | Tseng, Y. | |
| dc.contributor.author | Tabery, C. | |
| dc.contributor.author | De Poortere, E. P. | |
| dc.contributor.imecauthor | Carballo, V. M. Blanco | |
| dc.contributor.imecauthor | Renaud, V | |
| dc.contributor.imecauthor | Iacovo, S. | |
| dc.contributor.imecauthor | Jourdain, A. | |
| dc.date.accessioned | 2025-03-06T20:46:05Z | |
| dc.date.available | 2025-03-06T20:46:05Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/IITC61274.2024.10732582 | |
| dc.identifier.eisbn | 979-8-3503-8517-5 | |
| dc.identifier.isbn | 979-8-3503-8518-2 | |
| dc.identifier.issn | 2380-632X | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/45326 | |
| dc.publisher | IEEE | |
| dc.source.conference | 2024 International Interconnect Technology Conference | |
| dc.source.conferencedate | 2024-06-03 | |
| dc.source.conferencelocation | San Jose | |
| dc.source.numberofpages | 3 | |
| dc.title | Bonding induced distortion in wafer-to-wafer bonding applications: how the scanner and Yieldstar can enable 3D integration | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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