Publication:

Bonding induced distortion in wafer-to-wafer bonding applications: how the scanner and Yieldstar can enable 3D integration

Date

2024
Proceedings Paper
https://doi.org/10.1109/IITC61274.2024.10732582
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dc.contributor.authorBlanco, Victor
dc.contributor.authorRenaud, Vincent
dc.contributor.authorIacovo, Serena
dc.contributor.authorJourdain, Anne
dc.contributor.authorHsu, A.
dc.contributor.authorTseng, Y.
dc.contributor.authorTabery, C.
dc.contributor.authorDe Poortere, E. P.
dc.contributor.imecauthorCarballo, V. M. Blanco
dc.contributor.imecauthorRenaud, V
dc.contributor.imecauthorIacovo, S.
dc.contributor.imecauthorJourdain, A.
dc.date.accessioned2025-03-06T20:46:05Z
dc.date.available2025-03-06T20:46:05Z
dc.date.issued2024
dc.identifier.doi10.1109/IITC61274.2024.10732582
dc.identifier.eisbn979-8-3503-8517-5
dc.identifier.isbn979-8-3503-8518-2
dc.identifier.issn2380-632X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45326
dc.publisherIEEE
dc.source.conference2024 International Interconnect Technology Conference
dc.source.conferencedate2024-06-03
dc.source.conferencelocationSan Jose
dc.source.numberofpages3
dc.title

Bonding induced distortion in wafer-to-wafer bonding applications: how the scanner and Yieldstar can enable 3D integration

dc.typeProceedings paper
dspace.entity.typePublication
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