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Conference contributions
Experimental characterization of the vertical and lateral heat transfer in 3D-SIC packages
Publication:
Experimental characterization of the vertical and lateral heat transfer in 3D-SIC packages
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Date
2015-07
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Oprins, Herman
;
Cherman, Vladimir
;
Van der Plas, Geert
;
De Vos, Joeri
;
Beyne, Eric
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1911
since deposited on 2021-10-22
Acq. date: 2026-01-09
Citations
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1911
since deposited on 2021-10-22
Acq. date: 2026-01-09
Citations