Publication:
Fine pitch interconnection using anisotropic conducting adhesives
Date
| dc.contributor.author | Reese, E. | |
| dc.contributor.author | Vanfleteren, Jan | |
| dc.contributor.imecauthor | Vanfleteren, Jan | |
| dc.contributor.orcidimec | Vanfleteren, Jan::0000-0002-9654-7304 | |
| dc.date.accessioned | 2021-09-30T09:26:56Z | |
| dc.date.available | 2021-09-30T09:26:56Z | |
| dc.date.issued | 1997 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/2105 | |
| dc.source.beginpage | 457 | |
| dc.source.conference | Proceedings of the 11th European Microelectronics Conference; 14-16 May 1997. Venice, Italy. | |
| dc.source.conferencelocation | ||
| dc.source.endpage | 464 | |
| dc.title | Fine pitch interconnection using anisotropic conducting adhesives | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |