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Variation in process conditions of porogen-based low-k films: a method to improve performance without changing existing process steps in a sub-100nm Cu damascene integration route

Date

2009
Meeting abstract
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dc.contributor.authorDe Roest, David
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBeynet, Julien
dc.contributor.authorSprey, Hessel
dc.contributor.authorLabat, Julianne
dc.contributor.authorHuffman, Craig
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorKaneko, S.
dc.contributor.authorMatsushita, K.
dc.contributor.authorKobayashi, N.
dc.contributor.authorBeyer, Gerald
dc.contributor.imecauthorDe Roest, David
dc.contributor.imecauthorSprey, Hessel
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.date.accessioned2021-10-17T21:48:06Z
dc.date.available2021-10-17T21:48:06Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15179
dc.source.conference18th Workshop Materials for Advanced Metallization - MAM
dc.source.conferencedate8/03/2009
dc.source.conferencelocationGrenoble France
dc.title

Variation in process conditions of porogen-based low-k films: a method to improve performance without changing existing process steps in a sub-100nm Cu damascene integration route

dc.typeMeeting abstract
dspace.entity.typePublication
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