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Conference contributions
Reduced temperature flip-chip technologies on flexible display substrates using adhesives
Publication:
Reduced temperature flip-chip technologies on flexible display substrates using adhesives
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Date
2002
Proceedings Paper
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7087.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vanfleteren, Jan
;
Vandecasteele, Bjorn
;
Raevens, S.
;
Määttänen, J.
;
Perttula, P.
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Views
1845
since deposited on 2021-10-14
3
last month
1
last week
Acq. date: 2025-12-15
Citations