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An environment friendly wet strip process for 193 nm lithography patterning in BEOL applications

Date

2012
Meeting abstract
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dc.contributor.authorVereecke, Guy
dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorClaes, Martine
dc.contributor.authorLux, Marcel
dc.contributor.authorStruyf, Herbert
dc.contributor.authorCarleer, Robert
dc.contributor.authorAdriaensens, Peter
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorAdriaensens, Peter
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.date.accessioned2021-10-20T18:20:02Z
dc.date.available2021-10-20T18:20:02Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21775
dc.source.conferenceSEMATECH Surface Preparation and Cleaning Conference - SPCC
dc.source.conferencedate19/03/2012
dc.source.conferencelocationAustin, TX USA
dc.title

An environment friendly wet strip process for 193 nm lithography patterning in BEOL applications

dc.typeMeeting abstract
dspace.entity.typePublication
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