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Characterization of materials for low temperature bonding of miniaturized interconnects

Date

2014-09
Dissertation
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtualsource.department08221e79-108c-4673-a27b-2c705f2d7374
cris.virtualsource.orcid08221e79-108c-4673-a27b-2c705f2d7374
dc.contributor.advisorVerlinden, Bert
dc.contributor.authorDimcic, Biljana
dc.date.accessioned2026-05-06T11:52:05Z
dc.date.available2026-05-06T11:52:05Z
dc.date.issued2014-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59352
dc.provenance.editstepusermeghan.oneill@imec.be
dc.title

Characterization of materials for low temperature bonding of miniaturized interconnects

dc.typePHD thesis
dspace.entity.typePublication
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