Publication:
A new approach to flip chip on board technology using SMT compatible processes
Date
| dc.contributor.author | Zhang, S. | |
| dc.contributor.author | De Baets, J. | |
| dc.contributor.author | Van Calster, Andre | |
| dc.contributor.imecauthor | Van Calster, Andre | |
| dc.date.accessioned | 2021-10-14T11:59:49Z | |
| dc.date.available | 2021-10-14T11:59:49Z | |
| dc.date.issued | 1999 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/4046 | |
| dc.source.beginpage | 39 | |
| dc.source.endpage | 42 | |
| dc.source.issue | 3 | |
| dc.source.journal | Microelectronics International | |
| dc.source.volume | 16 | |
| dc.title | A new approach to flip chip on board technology using SMT compatible processes | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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