Analytical and finite element models of the thermal behaviour for lead-free soldering processes in electronic assembly

dc.contributor.author	Van Steenberge, Nele
dc.contributor.author	Vandevelde, Bart
dc.contributor.author	Schildermans, Inge
dc.contributor.author	Willems, Geert
dc.contributor.imecauthor	Vandevelde, Bart
dc.contributor.imecauthor	Willems, Geert
dc.contributor.orcidimec	Vandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimec	Willems, Geert::0000-0002-9137-618X
dc.date.accessioned	2021-10-16T06:26:07Z
dc.date.available	2021-10-16T06:26:07Z
dc.date.issued	2005-04
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/11442
dc.source.beginpage	675
dc.source.conference	Proceedings of the 6th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics
dc.source.conferencedate	17/04/2005
dc.source.conferencelocation	Berlin Germany
dc.source.endpage	680
dc.title	Analytical and finite element models of the thermal behaviour for lead-free soldering processes in electronic assembly
dc.type	Proceedings paper
dspace.entity.type	Publication
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