Publication:

Techno-Economic Analysis of MEC Clustering Models for Seamless CCAM Service Provision

Date

2023
Journal article
https://doi.org/10.1109/MCOM.001.2200299
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dc.contributor.authorChiha Ep Harbi, Asma
dc.contributor.authorDenis, Benoit
dc.contributor.authorVerbrugge, Sofie
dc.contributor.authorColle, Didier
dc.contributor.imecauthorChiha Ep Harbi, Asma
dc.contributor.imecauthorVerbrugge, Sofie
dc.contributor.imecauthorColle, Didier
dc.contributor.orcidimecVerbrugge, Sofie::0000-0002-4674-8693
dc.contributor.orcidimecColle, Didier::0000-0002-1428-0301
dc.contributor.orcidimecChiha Ep Harbi, Asma::0000-0002-7648-1598
dc.date.accessioned2023-08-08T12:19:18Z
dc.date.available2023-03-20T03:38:26Z
dc.date.available2023-03-20T09:10:04Z
dc.date.available2023-08-08T12:19:18Z
dc.date.embargo2023-02-16
dc.date.issued2023
dc.identifier.doi10.1109/MCOM.001.2200299
dc.identifier.issn0163-6804
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41310
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage32
dc.source.endpage37
dc.source.issue2
dc.source.journalIEEE COMMUNICATIONS MAGAZINE
dc.source.numberofpages6
dc.source.volume61
dc.subject.keywords5G
dc.title

Techno-Economic Analysis of MEC Clustering Models for Seamless CCAM Service Provision

dc.typeJournal article
dspace.entity.typePublication
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