Publication:
Corrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces
Date
| dc.contributor.author | Whelan, Caroline | |
| dc.contributor.author | Kinsella, Michael | |
| dc.contributor.author | Carbonell, Laure | |
| dc.contributor.author | Ho, Meng | |
| dc.contributor.author | Maex, Karen | |
| dc.contributor.imecauthor | Maex, Karen | |
| dc.date.accessioned | 2021-10-15T07:47:48Z | |
| dc.date.available | 2021-10-15T07:47:48Z | |
| dc.date.issued | 2003 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/8399 | |
| dc.source.beginpage | 551 | |
| dc.source.endpage | 557 | |
| dc.source.issue | 2_4 | |
| dc.source.journal | Microelectronic Engineering | |
| dc.source.volume | 70 | |
| dc.title | Corrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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