Publication:
Analysis of the performance of a micromechanical test structure to measure stress in thick electroplated metal films
Date
| dc.contributor.author | Smith, S. | |
| dc.contributor.author | Brockie, N. L. | |
| dc.contributor.author | Murray, J. | |
| dc.contributor.author | Wilson, Chris | |
| dc.contributor.author | Horsfall, A. B. | |
| dc.contributor.author | Terry, J. G. | |
| dc.contributor.author | Stevenson, J. T. M. | |
| dc.contributor.author | Mount, A. R. | |
| dc.contributor.author | Walton, A. J. | |
| dc.contributor.imecauthor | Wilson, Chris | |
| dc.date.accessioned | 2021-10-18T21:43:26Z | |
| dc.date.available | 2021-10-18T21:43:26Z | |
| dc.date.issued | 2010 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18005 | |
| dc.source.beginpage | 80 | |
| dc.source.conference | IEEE International Conference on Microelectronic Test Structures - ICMTS | |
| dc.source.conferencedate | 23/03/2010 | |
| dc.source.conferencelocation | Hiroshima Japan | |
| dc.source.endpage | 85 | |
| dc.title | Analysis of the performance of a micromechanical test structure to measure stress in thick electroplated metal films | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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