Publication:

Collective hybrid bonding for 3D stacking of ICs

Date

2008
Proceedings Paper
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dc.contributor.authorJourdain, Anne
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-17T07:54:50Z
dc.date.available2021-10-17T07:54:50Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13932
dc.source.beginpage77
dc.source.conference3D System Integration Conference - 3D-SIC
dc.source.conferencedate12/05/2008
dc.source.conferencelocationTokyo Japan
dc.source.endpage85
dc.title

Collective hybrid bonding for 3D stacking of ICs

dc.typeProceedings paper
dspace.entity.typePublication
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