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Industry-Relevant Heterojunction IBC Cells and Its Combination with 3D Woven Cell Interconnection Technology, Topped by Record Perovskite Modules for 27+% Tandem Devices

Date

2019
Presentation
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dc.contributor.authorVoroshazi, Eszter
dc.contributor.authorSivaramakrishnan Radhakrishnan, Hariharsudan
dc.contributor.authorVan Dyck, Rik
dc.contributor.authorJaysankar, Manoj
dc.contributor.authorKuang, Yinghuan
dc.contributor.authorBorgers, Tom
dc.contributor.authorGordon, Ivan
dc.contributor.authorAernouts, Tom
dc.contributor.authorGhannam, Moustafa
dc.contributor.authorPoortmans, Jef
dc.contributor.authorSzlufcik, Jozef
dc.contributor.imecauthorVoroshazi, Eszter
dc.contributor.imecauthorSivaramakrishnan Radhakrishnan, Hariharsudan
dc.contributor.imecauthorVan Dyck, Rik
dc.contributor.imecauthorJaysankar, Manoj
dc.contributor.imecauthorKuang, Yinghuan
dc.contributor.imecauthorBorgers, Tom
dc.contributor.imecauthorGordon, Ivan
dc.contributor.imecauthorAernouts, Tom
dc.contributor.imecauthorGhannam, Moustafa
dc.contributor.imecauthorPoortmans, Jef
dc.contributor.imecauthorSzlufcik, Jozef
dc.contributor.orcidimecSivaramakrishnan Radhakrishnan, Hariharsudan::0000-0003-1963-273X
dc.contributor.orcidimecVan Dyck, Rik::0000-0003-3947-4361
dc.contributor.orcidimecKuang, Yinghuan::0000-0002-1564-842X
dc.contributor.orcidimecBorgers, Tom::0000-0002-7878-6977
dc.contributor.orcidimecGordon, Ivan::0000-0002-0713-8403
dc.contributor.orcidimecAernouts, Tom::0000-0002-3004-6080
dc.contributor.orcidimecPoortmans, Jef::0000-0003-2077-2545
dc.date.accessioned2021-10-27T23:03:38Z
dc.date.available2021-10-27T23:03:38Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34406
dc.identifier.urlhttps://www.mrs.org/fall2019/symposium-sessions/symposium-sessions-detail?code=EN11
dc.source.conferenceMRS Fall Meeting
dc.source.conferencedate1/12/2019
dc.source.conferencelocationBoston, MA USA
dc.title

Industry-Relevant Heterojunction IBC Cells and Its Combination with 3D Woven Cell Interconnection Technology, Topped by Record Perovskite Modules for 27+% Tandem Devices

dc.typeOral presentation
dspace.entity.typePublication
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