Publication:
Combining BCB with KOH : wet bulk micromachining vs. wafer bonding
Date
| dc.contributor.author | Sterken, Tom | |
| dc.contributor.author | Fiorini, Paolo | |
| dc.contributor.author | Puers, Bob | |
| dc.contributor.imecauthor | Sterken, Tom | |
| dc.contributor.imecauthor | Puers, Bob | |
| dc.date.accessioned | 2021-10-16T05:26:07Z | |
| dc.date.available | 2021-10-16T05:26:07Z | |
| dc.date.issued | 2005 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/11272 | |
| dc.source.beginpage | 80 | |
| dc.source.conference | 16th MicroMechanics Europe Workshop - MME | |
| dc.source.conferencedate | 4/09/2005 | |
| dc.source.conferencelocation | Göteborg Sweden | |
| dc.source.endpage | 83 | |
| dc.title | Combining BCB with KOH : wet bulk micromachining vs. wafer bonding | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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