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Medium and atmospheric pressure plasma treatment for improvement of adhesion of PDMS used for flexible and stretchable electronics

Date

2008-08
Proceedings Paper
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dc.contributor.authorDe Geyter, N.
dc.contributor.authorMorent, R.
dc.contributor.authorAxisa, Fabrice
dc.contributor.authorDe Smet, N.
dc.contributor.authorGengembre, L.
dc.contributor.authorDe Leersnyder, E.
dc.contributor.authorLeys, C.
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorRymarczyk-Marchal, M.
dc.contributor.authorSchacht, E.
dc.contributor.authorPayen, E.
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned2021-10-17T06:44:18Z
dc.date.available2021-10-17T06:44:18Z
dc.date.embargo9999-12-31
dc.date.issued2008-08
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13602
dc.source.conference7th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
dc.source.conferencedate17/09/2008
dc.source.conferencelocationGarmisch-Partenkirchen Germany
dc.title

Medium and atmospheric pressure plasma treatment for improvement of adhesion of PDMS used for flexible and stretchable electronics

dc.typeProceedings paper
dspace.entity.typePublication
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