Will 3D stacking of ICs enable to continue Moore's momentum in the 21st century?

dc.contributor.author	Lauwereins, Rudy
dc.contributor.imecauthor	Lauwereins, Rudy
dc.contributor.orcidimec	Lauwereins, Rudy::0000-0002-3861-0168
dc.date.accessioned	2021-10-17T08:11:14Z
dc.date.available	2021-10-17T08:11:14Z
dc.date.embargo	9999-12-31
dc.date.issued	2008
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/13993
dc.source.conference	8th International Forum on Application-Specific SoC - MPSoC
dc.source.conferencedate	23/06/2008
dc.source.conferencelocation	Valkenburg Netherlands
dc.title	Will 3D stacking of ICs enable to continue Moore's momentum in the 21st century?
dc.type	Oral presentation
dspace.entity.type	Publication
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