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Integration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability

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dc.contributor.authorDe Roest, David
dc.contributor.authorVereecke, Bart
dc.contributor.authorHuffman, Craig
dc.contributor.authorHeylen, Nancy
dc.contributor.authorCroes, Kristof
dc.contributor.authorArai, H.
dc.contributor.authorTakamure, N.
dc.contributor.authorBeynet, Julien
dc.contributor.authorSprey, Hessel
dc.contributor.authorMatsushita, K.
dc.contributor.authorKobayashi, N.
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorDemuynck, Steven
dc.contributor.authorBeyer, Gerald
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorDe Roest, David
dc.contributor.imecauthorVereecke, Bart
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorSprey, Hessel
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.date.accessioned2021-10-17T21:48:19Z
dc.date.available2021-10-17T21:48:19Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15180
dc.source.conferenceADMETA 2009
dc.source.conferencedate19/10/2009
dc.source.conferencelocationTokyo Japan
dc.title

Integration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability

dc.typeOral presentation
dspace.entity.typePublication
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