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Barrier integrity effect on leakage mechanism and dielectric reliability of copper/OSG interconnects
Publication:
Barrier integrity effect on leakage mechanism and dielectric reliability of copper/OSG interconnects
Date
2005
Proceedings Paper
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10428.pdf
439 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Li, Yunlong
;
Tokei, Zsolt
;
Mandrekar, T.
;
Mebarki, Bencherki
;
Groeseneken, Guido
;
Maex, Karen
Journal
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1971
since deposited on 2021-10-16
Acq. date: 2025-10-23
Citations
Metrics
Views
1971
since deposited on 2021-10-16
Acq. date: 2025-10-23
Citations