Publication:

3D TSV based high frequency components for RF IC and RF MEMS applications

Date

2016
Proceedings Paper
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dc.contributor.authorFernandez-Bolanos, Montserrat
dc.contributor.authorVitale, Wolfgang
dc.contributor.authorMaqueda Lopez, Mariazel
dc.contributor.authorIonescu, Adrian M.
dc.contributor.authorOcket, Ilja
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorKlumpp, Armin
dc.contributor.authorMerkel, R.
dc.contributor.authorWeber, J.
dc.contributor.authorRamm, P.
dc.contributor.authorEnayati, Amin
dc.contributor.imecauthorOcket, Ilja
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.date.accessioned2021-10-23T10:47:58Z
dc.date.available2021-10-23T10:47:58Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26612
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7970030/
dc.source.beginpage1
dc.source.conferenceIEEE 3D System Integration Conference - 3DIC
dc.source.conferencedate9/11/2016
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage4
dc.title

3D TSV based high frequency components for RF IC and RF MEMS applications

dc.typeProceedings paper
dspace.entity.typePublication
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