Publication:

Stress and bowing engineering in passive silicon interposer

Date

2015
Proceedings Paper
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dc.contributor.authorDetalle, Mikael
dc.contributor.authorVandevelde, Bart
dc.contributor.authorNolmans, Philip
dc.contributor.authorMiller, Andy
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorNolmans, Philip
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T19:00:31Z
dc.date.available2021-10-22T19:00:31Z
dc.date.embargo9999-12-31
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25197
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7159606
dc.source.beginpage287
dc.source.conferenceIEEE 65th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate26/05/2015
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage292
dc.title

Stress and bowing engineering in passive silicon interposer

dc.typeProceedings paper
dspace.entity.typePublication
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