Publication:

Assemby of optoelectronics for efficient chip-to-waveguide coupling

Date

2013
Proceedings Paper
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dc.contributor.authorBosman, Erwin
dc.contributor.authorKaur, Kamalpreet
dc.contributor.authorMissinne, Jeroen
dc.contributor.authorVan Hoe, Bram
dc.contributor.authorVan Steenberge, Geert
dc.contributor.imecauthorKaur, Kamalpreet
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorVan Steenberge, Geert
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimecVan Steenberge, Geert::0000-0001-8574-1235
dc.date.accessioned2021-10-21T06:48:42Z
dc.date.available2021-10-21T06:48:42Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22067
dc.identifier.urlhttp://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6745795
dc.source.beginpage625
dc.source.conferenceIEEE 15th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate11/12/2013
dc.source.conferencelocationSingapore Singapore
dc.source.endpage629
dc.title

Assemby of optoelectronics for efficient chip-to-waveguide coupling

dc.typeProceedings paper
dspace.entity.typePublication
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