Nucleation and adhesion of ultra-thin copper films on amino-terminated self-assembled monolayers

dc.contributor.author	Bogan, Justin
dc.contributor.author	Brady-Boyd, Anita
dc.contributor.author	Armini, Silvia
dc.contributor.author	Lundy, R.
dc.contributor.author	Selvaraju, V.
dc.contributor.author	O'Connor, Robert
dc.contributor.imecauthor	Brady-Boyd, Anita
dc.contributor.imecauthor	Armini, Silvia
dc.contributor.orcidimec	Brady-Boyd, Anita::0000-0002-9257-6837
dc.contributor.orcidimec	Armini, Silvia::0000-0003-0578-3422
dc.date.accessioned	2021-10-25T16:48:51Z
dc.date.available	2021-10-25T16:48:51Z
dc.date.issued	2018
dc.identifier.issn	0169-4332
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/30279
dc.identifier.url	https://doi.org/10.1016/j.apsusc.2018.08.029
dc.source.beginpage	38
dc.source.endpage	47
dc.source.journal	Applied Surface Science
dc.source.volume	462
dc.title	Nucleation and adhesion of ultra-thin copper films on amino-terminated self-assembled monolayers
dc.type	Journal article
dspace.entity.type	Publication
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