Low-cost energy efficient on-chip hotspot targeted microjet cooling for high power electronics

dc.contributor.author	Wei, Tiwei
dc.contributor.author	Oprins, Herman
dc.contributor.author	Cherman, Vladimir
dc.contributor.author	Beyne, Eric
dc.contributor.author	Baelmans, Martine
dc.contributor.imecauthor	Wei, Tiwei
dc.contributor.imecauthor	Oprins, Herman
dc.contributor.imecauthor	Cherman, Vladimir
dc.contributor.imecauthor	Beyne, Eric
dc.contributor.orcidimec	Oprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimec	Beyne, Eric::0000-0002-3096-050X
dc.date.accessioned	2021-10-29T08:01:09Z
dc.date.available	2021-10-29T08:01:09Z
dc.date.issued	2020
dc.identifier.issn	2156-3950
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/36321
dc.identifier.url	https://ieeexplore.ieee.org/abstract/document/8878025
dc.source.beginpage	577
dc.source.endpage	589
dc.source.issue	4
dc.source.journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.volume	10
dc.title	Low-cost energy efficient on-chip hotspot targeted microjet cooling for high power electronics
dc.type	Journal article
dspace.entity.type	Publication
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