Publication:
The use of electroplating and electroless plating in the field of micro-electronic packaging and high density interconnections
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-14T16:37:33Z | |
| dc.date.available | 2021-10-14T16:37:33Z | |
| dc.date.issued | 2001 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/5065 | |
| dc.source.conference | Galvanic Forum; May 10, 2001; Eindhoven, The Netherlands. | |
| dc.source.conferencelocation | ||
| dc.title | The use of electroplating and electroless plating in the field of micro-electronic packaging and high density interconnections | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |