Publication:

System-Technology Co-Optimization for Dense Edge Architectures Using 3-D Integration and Nonvolatile Memory

 
dc.contributor.authorGiacomini Rocha, Leandro M.
dc.contributor.authorNaeim, Mohamed
dc.contributor.authorPaim, Guilherme
dc.contributor.authorBrunion, Moritz
dc.contributor.authorVenugopal, Priya
dc.contributor.authorMilojevic, Dragomir
dc.contributor.authorMyers, James
dc.contributor.authorBadaroglu, Mustafa
dc.contributor.authorVerhelst, Marian
dc.contributor.authorRyckaert, Julien
dc.contributor.authorBiswas, Dwaipayan
dc.contributor.imecauthorNaeim, Mohamed
dc.contributor.imecauthorBrunion, Moritz
dc.contributor.imecauthorVenugopal, Priya
dc.contributor.imecauthorMyers, James
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorBiswas, Dwaipayan
dc.contributor.imecauthorGiacomini Rocha, Leandro M.
dc.contributor.orcidimecBrunion, Moritz::0000-0001-7842-7774
dc.contributor.orcidimecVenugopal, Priya::0000-0002-9783-2713
dc.contributor.orcidimecBiswas, Dwaipayan::0000-0002-1087-3433
dc.contributor.orcidimecGiacomini Rocha, Leandro M.::0000-0003-2883-2768
dc.date.accessioned2025-06-19T14:52:27Z
dc.date.available2024-12-19T16:39:08Z
dc.date.available2025-06-19T14:52:27Z
dc.date.embargo2024-11-11
dc.date.issued2024
dc.identifier.doi10.1109/JXCDC.2024.3496118
dc.identifier.issn2329-9231
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44993
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage125
dc.source.endpage134
dc.source.issueN/A
dc.source.journalIEEE JOURNAL ON EXPLORATORY SOLID-STATE COMPUTATIONAL DEVICES AND CIRCUITS
dc.source.numberofpages10
dc.source.volume10
dc.title

System-Technology Co-Optimization for Dense Edge Architectures Using 3-D Integration and Nonvolatile Memory

dc.typeJournal article
dspace.entity.typePublication
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