Publication:

Adaptive patterning of optical and electrical fan-out for photonic chip packaging

Date

2019
Proceedings Paper
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dc.contributor.authorElmogi Mosad, Ahmed
dc.contributor.authorDesmet, Andres
dc.contributor.authorMissinne, Jeroen
dc.contributor.authorRamon, Hannes
dc.contributor.authorLambrecht, Joris
dc.contributor.authorDe Heyn, Peter
dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorVan Campenhout, Joris
dc.contributor.authorBauwelinck, Johan
dc.contributor.authorVan Steenberge, Geert
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorRamon, Hannes
dc.contributor.imecauthorLambrecht, Joris
dc.contributor.imecauthorDe Heyn, Peter
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.imecauthorBauwelinck, Johan
dc.contributor.imecauthorVan Steenberge, Geert
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimecLambrecht, Joris::0000-0001-8291-0339
dc.contributor.orcidimecDe Heyn, Peter::0000-0003-3523-7377
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.contributor.orcidimecBauwelinck, Johan::0000-0001-5254-2408
dc.contributor.orcidimecVan Steenberge, Geert::0000-0001-8574-1235
dc.date.accessioned2021-10-27T09:04:21Z
dc.date.available2021-10-27T09:04:21Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32937
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8811278
dc.source.beginpage1757
dc.source.conferenceIEEE 69th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedate28/05/2019
dc.source.conferencelocationLas Vegas USA
dc.source.endpage1763
dc.title

Adaptive patterning of optical and electrical fan-out for photonic chip packaging

dc.typeProceedings paper
dspace.entity.typePublication
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