Publication:

Special Section Guest Editorial: Packaging Challenges of Photonic Integrated Circuits

Date

2024
Editorial Material
https://doi.org/10.1117/1.JOM.4.1.011001
Simple item page Full metadata Statistics
 
dc.contributor.authorMissinne, Jeroen
dc.contributor.authorLi, Yanlu
dc.contributor.authorMohrdiek, Stefan
dc.contributor.authorMorrissey, Padraic
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorLi, Yanlu
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimecLi, YanLu::0000-0003-3440-1972
dc.date.accessioned2025-04-10T13:21:53Z
dc.date.available2024-09-14T17:21:08Z
dc.date.available2025-04-10T13:21:53Z
dc.date.embargo2024-01-27
dc.date.issued2024
dc.identifier.doi10.1117/1.JOM.4.1.011001
dc.identifier.issn1932-5150
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44484
dc.publisherSPIE-SOC PHOTO-OPTICAL INSTRUMENTATION ENGINEERS
dc.source.beginpageArt. 011001
dc.source.endpageN/A
dc.source.issue1
dc.source.journalJOURNAL OF OPTICAL MICROSYSTEMS
dc.source.numberofpages2
dc.source.volume4
dc.title

Special Section Guest Editorial: Packaging Challenges of Photonic Integrated Circuits

dc.typeEditorial material
dspace.entity.typePublication
Files

Original bundle

Name:
011001_1.pdf
Size:
425.17 KB
Format:
Adobe Portable Document Format
Description:
Published version
Download
Publication available in collections:
Articles