Publication:

Porous dielectric materials for back-end-of-line interconnect

Date

2016
Meeting abstract
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dc.contributor.authorLe, Quoc Toan
dc.contributor.authorKesters, Els
dc.contributor.authorHolsteyns, Frank
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.date.accessioned2021-10-23T12:04:35Z
dc.date.available2021-10-23T12:04:35Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26882
dc.source.conferenceInternational Workshop on Advanced Materials Science and Nanotechnology - HIWAMSN
dc.source.conferencedate8/11/2016
dc.source.conferencelocationHa Long Bay Vietnam
dc.title

Porous dielectric materials for back-end-of-line interconnect

dc.typeMeeting abstract
dspace.entity.typePublication
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