Publication:
Multilayer thin-film technology, enabling technology for solving high-density interconnect and assembly problems
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-15T04:01:14Z | |
| dc.date.available | 2021-10-15T04:01:14Z | |
| dc.date.issued | 2003 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/7208 | |
| dc.source.beginpage | 191 | |
| dc.source.endpage | 199 | |
| dc.source.journal | Nuclear Instruments & Methods in Physics Research A | |
| dc.source.volume | 509 | |
| dc.title | Multilayer thin-film technology, enabling technology for solving high-density interconnect and assembly problems | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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