Publication:
Ultra-thin BCB bonding for heterogeneous integration of III-V devices and SOI photonic components
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1925 since deposited on 2021-10-16
3last month
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Acq. date: 2026-05-08
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Statistics
Views
1925 since deposited on 2021-10-16
3last month
2last week
Acq. date: 2026-05-08
Citations